COPPER NICKEL BARREL 

Copper nickel plating is a process of electroplating metal that involves depositing a thin layer of copper or other metals onto the surface of the part being plated. This layer is a barrier that protects the underlying metal from corrosion and wears.

The copper-nickel plating process begins by preparing the surface to be coated with an electrolyte solution made from water and acid or salt. An electrical current is then applied between two electrodes – one positive (the cathode) and one negative (the anode). This causes ions in the electrolyte solution to be attracted to either electrode depending on their charge. At the cathode, these ions are reduced into atoms, forming a thin layer on top of the metal surface being plated – this is called electrodeposition. The process continues until the desired thickness has been achieved.